Heat dissipation board materials - List of Manufacturers, Suppliers, Companies and Products

Heat dissipation board materials Product List

1～2 item / All 2 items

Displayed results
[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)

[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)

[Available for preview] ~ Substrate, Joining, Sealing, Cooling Technologies ~

Book Title: Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Countermeasures －－－－－－－－－－－－－－－－－－－－－ ◎ Thorough explanation of Si, SiC, GaN, gallium oxide, required characteristics in automotive environments, and implementation examples! ◎ Detailed guidelines for designing TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"! －－－－－－－－－－－－－－－－－－－－－ ■ This book includes the following information: - Improving the heat resistance of resins and measures against material expansion - Composite materials of thermally conductive fillers and resins - Development trends of resin substrates, ceramic substrates, and metal substrate materials - Countermeasures for failures such as warping, delamination, and breakage caused by inter-material stress due to linear expansion coefficients - Response to high-temperature operation above 300°C and low-temperature operation below freezing - Balancing thermal conductivity, mechanical properties, electrical insulation properties, and strength reliability - Improvement of thermal fatigue characteristics against repeated stress due to heat resistance and differences in linear expansion, and crack countermeasures - Suppression of electromigration and electrochemical migration - Ensuring moisture resistance, oxidation resistance, heat resistance, and long-term reliability of metal sintered materials

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Ultra-thin, lightweight heat dissipation substrate without adhesive type! It can be processed in three dimensions, allowing for the production of substrates in various shapes!

Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be processed in three dimensions, making it suitable for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ Three-dimensional processing is possible, allowing for the creation of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, resulting in good machinability. ■ It is suitable for chip-on-board (COB) mounting of bare chips. *For more details, please request materials or view the PDF data available for download.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Related Categories of Heat dissipation board materials

COPYRIGHT © 2001-2025 IPROS CORPORATION ALL RIGHTS RESERVED.